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Intelligent ultra-high-definition cloud interconnection chip
2023-05-18
Category: Company News
Founded in November 2018, Zhuhai Haiqi Semiconductor is committed to the design and development of complex digital-analog hybrid SOC chips. The intelligent ultra-high-definition cloud interconnection chip has ultra-high compatibility, the screen display screen resolution can reach 11KP8, and the project products can achieve smaller size while ensuring high definition and low latency.
Intelligent ultra-high-definition cloud interconnection chip project Roadshow scene Source: Maker Guangdong
Judge: Can you describe this chip in one word or a point?
Wang Xiang: The main thing is cost performance. To achieve cost performance, we have made various patented technologies and hardwareized software technology. The second- and third-generation chips are not only doing cost-effectiveness, but also the decoding and hardware of the protocol.
Judge: Is the cost performance of the first generation of chips aimed at the market of screen projection?
Wang Xiang: The first generation of chips has two competitive advantages, the first is the latecomer advantage, only for interconnection, that is, for the market to do, the connection to the best, the display to the best, only pursue the cost performance, and remove the things that are not needed. The second is continuous commemorative optimization in the process.
Judge: And other decoding chips on the market, only the advantage of being late?
Wang Xiang: The second generation is going to do cloud computers, and in terms of decoding, we have made private, public-compatible coding technology, which can reach more than 300 megabytes of interfaces. It will be a fatal blow to Microsoft and Intel.
Judge: How much did 500 chips sell for last year?
Wang Xiang: 1.5-3.5 US dollars.
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2024-06-05
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